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HDI PCB High Density Interconnect 8+N+8 Micro Via Blind Buried

Unit Price
$ 15.00 / Piece
location
All
stock
10000Piece 起订1Piece

Detailed Information

HDI PCB High Density Interconnect 8+N+8 Micro Via Blind Buried

HDI PCB high density interconnect 8+N+8 micro via blind buried. Features HDI Class 3, microvias 0.1mm, laser drilled, impedance control, ENIG surface finish, IPC Class 3. Perfect for smartphones, tablets, and high-density electronics. 12 years manufacturing experience. IPC Class 3 certified. MOQ 1 piece. OEM/ODM available.

Product Details:

  • Category: HDI PCB
  • Price: US$15.00-150.00 / Piece
  • MOQ: 1 Piece
  • Origin: Shenzhen, Guangdong, China
  • Supplier: PCBINQ Technology Co., Ltd.

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